JPS5757896A - Electrolyzing device for strip-like metallic plate - Google Patents

Electrolyzing device for strip-like metallic plate

Info

Publication number
JPS5757896A
JPS5757896A JP13389080A JP13389080A JPS5757896A JP S5757896 A JPS5757896 A JP S5757896A JP 13389080 A JP13389080 A JP 13389080A JP 13389080 A JP13389080 A JP 13389080A JP S5757896 A JPS5757896 A JP S5757896A
Authority
JP
Japan
Prior art keywords
plate
electrolyte
strip
surface side
metallic plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13389080A
Other languages
English (en)
Japanese (ja)
Other versions
JPS623240B2 (en]
Inventor
Teruo Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Holdings Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Priority to JP13389080A priority Critical patent/JPS5757896A/ja
Publication of JPS5757896A publication Critical patent/JPS5757896A/ja
Publication of JPS623240B2 publication Critical patent/JPS623240B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP13389080A 1980-09-26 1980-09-26 Electrolyzing device for strip-like metallic plate Granted JPS5757896A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13389080A JPS5757896A (en) 1980-09-26 1980-09-26 Electrolyzing device for strip-like metallic plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13389080A JPS5757896A (en) 1980-09-26 1980-09-26 Electrolyzing device for strip-like metallic plate

Publications (2)

Publication Number Publication Date
JPS5757896A true JPS5757896A (en) 1982-04-07
JPS623240B2 JPS623240B2 (en]) 1987-01-23

Family

ID=15115486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13389080A Granted JPS5757896A (en) 1980-09-26 1980-09-26 Electrolyzing device for strip-like metallic plate

Country Status (1)

Country Link
JP (1) JPS5757896A (en])

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62250197A (ja) * 1986-04-21 1987-10-31 Taisho Kogyo Kk メツキ装置
JPH0319314B2 (en]) * 1982-02-09 1991-03-14 Yooko Kareui Korupi
WO2007086510A1 (ja) * 2006-01-30 2007-08-02 Ibiden Co., Ltd. めっき装置及びめっき方法
US7481909B2 (en) 2004-09-24 2009-01-27 Ibiden Co., Ltd. Plating apparatus, plating method and multilayer printed circuit board
US8679576B2 (en) 2006-02-22 2014-03-25 Ibiden Co., Ltd. Plating apparatus and method of plating
KR101712170B1 (ko) * 2015-11-30 2017-03-06 (주)동진금속 전선용 연 알루미늄 도체 연속산화피막장치 및 이를 사용한 연 알루미늄 도체 연속산화피막방법

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0319314B2 (en]) * 1982-02-09 1991-03-14 Yooko Kareui Korupi
JPS62250197A (ja) * 1986-04-21 1987-10-31 Taisho Kogyo Kk メツキ装置
US7481909B2 (en) 2004-09-24 2009-01-27 Ibiden Co., Ltd. Plating apparatus, plating method and multilayer printed circuit board
US7897027B2 (en) 2004-09-24 2011-03-01 Ibiden Co., Ltd. Plating apparatus, plating method and multilayer printed circuit board
US8197659B2 (en) 2004-09-24 2012-06-12 Ibiden Co., Ltd. Plating apparatus, plating method and multilayer printed circuit board
US8383956B2 (en) 2004-09-24 2013-02-26 Ibiden Co., Ltd. Plating apparatus, plating method and multilayer printed circuit board
WO2007086510A1 (ja) * 2006-01-30 2007-08-02 Ibiden Co., Ltd. めっき装置及びめっき方法
JP4781371B2 (ja) * 2006-01-30 2011-09-28 イビデン株式会社 めっき装置及びめっき方法
US8128790B2 (en) 2006-01-30 2012-03-06 Ibiden Co., Ltd. Plating apparatus and plating method
US8721863B2 (en) 2006-01-30 2014-05-13 Ibiden Co., Ltd. Plating apparatus and plating method
US8679576B2 (en) 2006-02-22 2014-03-25 Ibiden Co., Ltd. Plating apparatus and method of plating
KR101712170B1 (ko) * 2015-11-30 2017-03-06 (주)동진금속 전선용 연 알루미늄 도체 연속산화피막장치 및 이를 사용한 연 알루미늄 도체 연속산화피막방법

Also Published As

Publication number Publication date
JPS623240B2 (en]) 1987-01-23

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